Soldering Equipment - List of Manufacturers, Suppliers, Companies and Products

Soldering Equipment Product List

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The IH soldering device "S-WAVE" achieves zero waste soldering.

The IH soldering device "S-WAVE" achieves zero waste soldering.

Zero waste solder + CO2 reduction for environmental measures!

The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, allowing for soldering in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and efficient soldering even on high-density printed circuit boards. Since solder heating can be done non-contact, it achieves zero waste solder (free from residual solder on tips or in tanks). This contributes to environmental issues by reducing CO2 emissions and lowering costs (as a significant amount of CO2 is emitted during the recycling process of waste solder). <Features> ■ Energy-saving due to fewer consumables ■ Non-contact localized heating ■ Soldering possible from below ■ Low maintenance and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ High precision and high-speed soldering is achievable *For more details, please refer to the PDF materials.

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IH soldering device S-WAVE [Improving solder quality and increasing production volume]

IH soldering device S-WAVE [Improving solder quality and increasing production volume]

High-quality requirements and mass production are met with "non-contact soldering." A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.

The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It excels in production processes with high quality demands and is suitable for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] below. ＜ Common issues with soldering ＞ ◎ The running costs of adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.

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ERSA Automatic Local Jet Soldering Machine

ERSA Automatic Local Jet Soldering Machine

This is a selective point dip soldering device from the German company ERSA, which boasts the world's top market share.

◆Value of ERSA ERSA's automatic localized jet soldering equipment boasts the world's top market share among selective point soldering devices. ERSA believes that providing the best equipment for assembly lines is the most effective approach. Leading the world in automatic localized jet soldering technology, it maximizes production efficiency for high value-added products that fit every requirement. ◆Technology of ERSA All models use the same solder pot and electromagnetic induction jet pump. Regardless of the model chosen, there is no change in performance or high soldering quality. With no moving parts like those found in propeller pumps, it allows for stable and high-precision jet control, resulting in minimal dross generation and very low maintenance frequency. The unique peel-off control rapidly drops the jet, enabling solder to be cut without overrunning and without bridging, even on narrow pitch patterns at the edges of the substrate. A variety of options can also be equipped.

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[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

Achieving OEE improvement and CT reduction in the soldering process. Minimizing upstream and downstream processes while maximizing automatic soldering time with the IH soldering device 'S-WAVE'.

The IH soldering device "S-WAVE" was born as a device that allows for soldering that is "tool exchange-free" and "fast and beautiful with high thermal capacity." This document introduces the improvement in production capacity resulting from the above two features. It provides detailed explanations on "changes in the soldering process flow with S-WAVE" and "improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.

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Overcoming soldering challenges: "IH Soldering Device" [Case Study]

Overcoming soldering challenges: "IH Soldering Device" [Case Study]

Since it heats metal without contact, soldering is possible even with a "4mm" wall terminal! We also introduce examples of achieving soldering on a 6-layer thick copper substrate.

The IH soldering device "S-WAVE" has a magnetic concentration head tip that operates below 100°C, while the terminals can rise to 250°C. This allows for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have become more common in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Examples" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Examples" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the benefits of the WAVE series IH soldering, making it easy to reference when considering implementation. **Benefits of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

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[IH Soldering Example] Wall Terminal

[IH Soldering Example] Wall Terminal

Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!

We would like to introduce a case of IH soldering performed on the edge terminals of automotive products. When the resin part is close to the terminals, the soldering iron method can cause issues with radiant heat, and the laser method can have problems with reflected light, often resulting in the melting of the resin part. In the case of the IH method, the magnetic concentration head tip has the characteristic of raising the terminal temperature to 250°C while remaining below 100°C for the surrounding resin, allowing for soldering without any issues even when resin is nearby. [Case Summary] ■ Issues - The soldering iron method can cause problems with radiant heat, and the laser method can have issues with reflected light, often melting the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

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Compatible with characteristic substrates! 3D localized heating IH soldering device.

Compatible with characteristic substrates! 3D localized heating IH soldering device.

Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It is compatible with distinctive substrates such as busbars, power semiconductors, 4-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards requiring a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Compatibility with distinctive substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

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IH soldering device "S-WAVE FBA Series"

IH soldering device "S-WAVE FBA Series"

Equipped with loader/unloader! Targets inline processing after soldering and multi-product production, etc.

The "S-WAVE FBA Series" is a product designed to suppress solder balls during low-temperature soldering at 250°C. It allows for non-contact tool changes that are not needed for an extended period. It is applicable to general through-hole mounting of electronic components, terminals with insufficient solder, and areas with heat-sensitive components or surrounding parts. Additionally, it reduces solder material consumption through wire solder supply, and the power consumption during soldering is less than 300W. 【Features】 ■ Suppresses solder balls during low-temperature soldering at 250°C ■ Non-contact tool changes are not needed for an extended period ■ Daily maintenance is automated with a temperature checker/cleaning device (optional) ■ Reduces solder material consumption through wire solder supply ■ Power consumption is less than 300W (during soldering) *For more details, please refer to the PDF document or feel free to contact us.

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Production equipment and tools: Small automatic soldering device

Production equipment and tools: Small automatic soldering device

From conventional large equipment to compact! Shortened time for solder melting!

Maruhi Co., Ltd. engages in everything from the design and development of production equipment and tools to parts processing and assembly. We possess processing equipment such as NC lathes, machining centers, wire cutting, internal grinding, and external grinding, and we respond to customer requests from prototypes to mass production. Our compact automatic soldering device has been reduced in size from traditional large equipment and has achieved a shorter time for solder melting. Compared to jet flow types, it significantly reduces electricity and solder consumption. It is energy-efficient and ensures a stable solder level while reducing solder oxidation. For more details, please contact us or refer to our catalog.

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IH soldering device utilizing non-contact heating technology.

IH soldering device utilizing non-contact heating technology.

Automating the hand soldering process! This equipment enables soldering that shortens cycle times, reduces environmental impact, and achieves precise soldering!

Introducing the IH soldering equipment handled by Toyama Gihan. Equipped with non-contact localized heating that allows for soldering without contact. It does not re-melt the surrounding solder areas. Additionally, it supports automatic alignment, rapid heating of large and small terminals, and post-heating treatment. Currently, it accommodates terminals ranging from φ0.3 to φ1.5. 【Features】 ■ Non-contact localized heating ■ Does not re-melt the surrounding solder areas ■ Achieves precise soldering ■ Realizes localized heating ■ Supports automatic alignment, rapid heating of large and small terminals, and post-heating treatment ■ Almost no consumable parts ■ Compatible with terminals from φ0.3 to φ1.5 ■ Reduction of solder balls possible (achieved through precise feeding) *For more details, please refer to the PDF document.

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